| Why | Category | Data centers & chips |
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| Level | Medium |
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| Use | Layer between chip and cold plate that conducts heat and stays soft |
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| What | Atoms | Filler + polymer contact 500–2k for heat-flow runs. B N Al O Si C H |
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| Build | Testing | Medium Mix paste, measure thermal resistance |
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| Funding | Compute ~$150 · Make ~$5–20k · Test ~$10–25k · Other ~$10k patent |
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| Time | Make 2–6 wks · Test 2–4 wks · Total ~1–3 months |
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| How | Contact us for the design specs and build plan → |
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| Demo | Heat pulses cross the new filler faster than today’s paste |
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| Competition | Silicone pastes with boron nitride or alumina, liquid metal, indium |
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| Business | Buyers | Henkel, Dow, Shin-Etsu, Laird, server makers |
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| Revenue | High License to TIM makers. ~$1–5M/yr |
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